CLIP MODULE AND HEAT-DISSIPATION DEVICE HAVING THE

专利名称：CLIP MODULE AND HEAT-DISSIPATION

DEVICE HAVING THE SAME

发明人：Kung-Jen Yan申请号：US11950714申请日：20071205

公开号：US20080137305A1公开日：20080612

专利附图：

摘要：A clip module and heat-dissipation device having the same is disclosed. Theheat-dissipation device includes a retention module (RM) disposed on a circuit boardhaving a heat-source, a heat sink disposed on the heat-source, and a clip module. The clip

module is across in the heat sink and is clipped with the RM. The clip module includes abody, a fastener, and a pressing structure. One end of the body is clipped with the RM,and the heat sink is pressed on the heat-source by the body. The fastener is disposed inthe other end of the body. One end of the fastener is clip with the RM, and a guidingportion is disposed in the other end of the fastener. The guiding portion is slid in aguiding groove of the pressing structure, so that the pressing structure is connected withthe fastener.

申请人：Kung-Jen Yan

地址：Taipei TW

国籍：TW

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