Voltage multiplexed chip IO for multi-chip module

专利名称：Voltage multiplexed chip I/O for multi-chip

modules

发明人：Kenneth Rush,Eldon Cornish,Steve Draving申请号：US08/657987申请日：19960604公开号：US05815100A公开日：19980929

摘要：An electrical interconnect between a plurality of output nodes of a firstintegrated circuit (IC) and a plurality of input nodes of a second IC, the interconnect. Afirst bond pad located on the first integrated circuit is coupled to the output nodes. Asecond bond pad located on the second integrated circuit is coupled to the input nodes.A first digital- to-analog converter located on the first integrated circuit and having anoutput coupled to the first bond pad receives a plurality of binary inputs from the outputnodes of the first integrated circuit. A first analog-to-digital converter is located on thesecond integrated circuit and coupled to the second bond pad and has an output linecoupled to each of the plurality of input nodes of the second IC.

申请人：HEWLETT-PACKARD COMPANY

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