TLOM1050(T20)_TLYM1050(T20)_en_datasheet_090709

TLRM1050(T20),TLRMM1050(T20),TLSM1050(T20),

TLOM1050(T20),TLYM1050(T20)

Unit: mm

Panel Circuit Indicator

• 5.2 (L) × 5.2 (W) × 4.0 (H) mm • φ3.6 mm transparent lens top type • InGaAℓP LEDs

• High luminous intensity and low power consumption. • Color : red, orange, yellow • High operating temperature

Topr : −40 to 100°C / Tstg: −40 to 110°C • Surface-mount devices

• Standard embossed tape packing

8-mm component pitch: T20 (400 pcs/reel) • Reflow-soldering is available

• Applications: amusement, message signboards, automotive interiors and

exteriors, etc.

Color and Material

Part Number

Color

Material

TLRM1050 Red TLRMM1050 Red TLSM1050 Red TLOM1050 Orange TLYM1050 Yellow

InGaAℓP

JEDEC JEITA

Weight : 0.085 g (typ.)

― ―

TOSHIBA 4-5AU1 12009-07-09

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www.smdled.com

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comAbsolute Maximum Ratings (Ta = 25°C)

Product

Name TLRM1050 TLRMM1050 TLSM1050 TLOM1050 TLYM1050

50 4 135 −40 to 100

−40 to 110

Forward Current IF(mA)

Reverse Voltage

VR(V)

Power Dissipation

PD (mW)

Operating Temperature Topr (℃)

Storage Temperature Tstg (℃)

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant

change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

Note 1: Forward current derating

80

IF – Ta

Allowable forward current IF (mA) 60

40

20

0 0

20 406080100 120

Ambient temperature Ta (°C)

Electrical Characteristics (Ta = 25°C)

Product Name

Forward Voltage VF

Reverse Current IR

Min Typ. Max IF Max VR

2.3 2.7

4

TLRM1050 2.0

TLRMM1050 2.0 2.3 2.7 TLSM1050 2.0 TLOM1050 2.0 TLYM1050 2.3 2.7 20 10 2.3 2.7

2.0 2.3 2.7 Unit V mA μA V 22009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comOptical Characteristics-1 (Ta = 25°C)

Product Name

TLRM1050 TLRMM1050 TLSM1050 TLOM1050 TLYM1050

Luminous Intensity IV

Min Typ. Max IF 630 1000 1600

1800 3200 2000 5000

Corresponding brightness

rank sign (Note 2)

VA/WA/XA WA/XA/YA XA/YA/ZA XA/YA/ZA XA/YA/ZA

2800 8000 20

1600 3500 8000 1600 3000 8000 Unit mcd mA Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.

Brightness rank

Rank sign

VA WA XA YA ZA Unit

Min 630 1000 1600 2500 4000 mcd

Max 1250 2000 3200 5000 8000 mcd

Optical Characteristics-2 (Ta = 25°C)

Emission Spectrum

Product Name

Peak Emission Wavelength λp

Δλ Dominant Wavelength λd

Min Typ. Max Typ Min Typ. Max IF

TLRM1050 TLRMM1050 TLSM1050 TLOM1050 TLYM1050

⎯ ⎯ ⎯

4 636 623

⎯ ⎯ ⎯

14 14 14

624 620 607

630 626 613

638 634 621

20

⎯ 612 ⎯ 592

⎯ 14 599 605 613 ⎯ 13 583 590 595 Unit nm nm nm mA

Caution

z This product is a product developed as a display source of light usage, and the measurement standard matched to

the sensitivity of human eyes is applied.

Therefore, functional usages (source of light for the sensor and the communication) other than the source of light for the display is not intended.

32009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comTLRM1050

100 Ta = 25°C Ta = 25°C IF – VF IV – IF

Luminous intensity IV (mcd) Forward voltage VF (V)

Forward current IF (mA) 300030 100010 3001003 301 1.8 2.0 2.2 2.4 2.6 2.8 3.0 101 10 3 30 100

Forward current IF (mA)

IV – Tc

10 1.0

Wavelength characteristic

IF = 20 mA Relative luminous intensity IV Relative luminous intensity 5 3 Ta = 25°C 0.80.61 0.5 0.3 0.40.20.1 −40

−20 0 20 40 60 80 100

0580 600 620 0 660 680 700

Case temperature Tc (°C) Wavelength λ (nm)

Radiation pattern

Ta = 25°C

20°

10° 0° 10°

30° 40° 50° 60° 70° 80° 90° 20°

30°

40°

50°60° 70°80°

0

90°

0.2 0.4 0.60.81.0

42009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comTLRMM1050

100 Ta = 25°C Ta = 25°C IF – VF IV – IF

Luminous intensity IV (mcd) Forward current IF (mA) 300030 100010 3001003 301 1.8 2.0 2.2 2.4 2.6 2.8 3.0

101 10 3 30 100

Forward voltage VF (V) Forward current IF (mA)

IV – Tc

10 1.0

Wavelength characteristic

IF = 20 mA Relative luminous intensity IV Relative luminous intensity 5 3 Ta = 25°C 0.80.61 0.5 0.3 0.40.20.1 −40

−20 0 20 40 60 80 100

0580 600 620 0 660 680 700

Case temperature Tc (°C) Wavelength λ (nm)

Radiation pattern

Ta = 25°C

20°

10° 0° 10°

30° 40° 50° 60° 70° 80° 90° 20°

30°

40°

50°60° 70°80°

0

90°

0.2 0.4 0.60.81.0

52009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comTLSM1050

100 Ta = 25°C Ta = 25°C IF – VF IV – IF

Luminous intensity IV (mcd) Forward voltage VF (V)

Forward current IF (mA) 300030 100010 3001003 301 1.8 2.0 2.2 2.4 2.6 2.8 3.0 101 10 3 30 100

Forward current IF (mA)

IV – Tc

10 1.0

Wavelength characteristic

IF = 20 mA Relative luminous intensity IV Relative luminous intensity 5 3 Ta = 25°C 0.80.61 0.5 0.3 0.40.20.1 −40

−20 0 20 40 60 80 100

0580 600 620 0 660 680 700

Case temperature Tc (°C) Wavelength λ (nm)

Radiation pattern

Ta = 25°C

20°

10° 0° 10°

30° 40° 50° 60° 70° 80° 90° 20°

30°

40°

50°60° 70°80°

0

90°

0.2 0.4 0.60.81.0

62009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comTLOM1050

100 Ta = 25°C Ta = 25°C IF – VF IV – IF

Luminous intensity IV (mcd) Forward voltage VF (V)

Forward current IF (mA) 300030 100010 3001003 301 1.8 2.0 2.2 2.4 2.6 2.8 3.0 101 10 3 30 100

Forward current IF (mA)

IV – Tc

10 1.0

Wavelength characteristic

IF = 20 mA Relative luminous intensity IV Relative luminous intensity 5 3 Ta = 25°C 0.80.61 0.5 0.3 0.40.20.1 −40

−20 0 20 40 60 80 100

Case temperature Tc (°C)

00 580 560 0 600 620 660 0.4

Wavelength λ (nm)

Radiation pattern

Ta = 25°C

20°

10° 0° 10°

30° 40° 50° 60° 70° 80° 90° 20°

30°

40°

50°60° 70°80°

0

90°

0.2 0.4 0.60.81.0

72009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comTLYM1050

100 Ta = 25°C Ta = 25°C IF – VF IV – IF

Luminous intensity IV (mcd) Forward voltage VF (V)

Forward current IF (mA) 300030 100010 3001003 301 1.8 2.0 2.2 2.4 2.6 2.8 3.0 101 10 3 30 100

Forward current IF (mA)

IV – Tc

10 1.0

Wavelength characteristic

IF = 20 mA Relative luminous intensity IV Relative luminous intensity 5 3 Ta = 25°C 0.80.61 0.5 0.3 0.40.20.1 −40

−20 0 20 40 60 80 100

00 580 560 0 600 620 660

Case temperature Tc (°C) Wavelength λ (nm)

Radiation pattern

Ta = 25°C

20°

10° 0° 10°

30° 40° 50° 60° 70° 80° 90° 20°

30°

40°

50°60° 70°80°

0

90°

0.2 0.4 0.60.81.0

82009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comPackaging

These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent moisture

absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions:

1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.

Temperature: 5°C to 30°C Humidity: 90% (max)

2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an environment

of 5°C to 30°C/70% RH or below.

3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color changes to

pink) or the expiration date has passed, the devices should be baked while packed in the tape reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60 ±5°C, for 12 to 24 hours.

Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.

4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure

to prevent damage to the device from static electricity during the baking process.

5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do not

toss or drop the packed devices.

Mounting Method

Soldering

• Reflow soldering (example)

Package surface temperature (°C) Temperature profile for Pb soldering (example)

10 s max (*)240°C max Temperature profile for Pb-free soldering (example)

(*) 5 s max Package surface temperature (°C) 260°C max(*) (*)

140 to 160°C max(*) 4°C/s max (*) 4°C/s max(*)max(*)150 to 180°C230°C4°C/s max(*)60 to 120 s max(*) Time (s)

(*)4°C/s max60 to 120 s max(*) 30 to 50s max(*) Time (s)

• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the

condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. • Perform the first reflow soldering in accordance with the above temperature profile and within 168 hours of opening

the package. • Second time reflow

In case of second reflow soldering should be performed within 168 hours of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 5 to 30°C, 70% RH max • Do not perform flow soldering and dip soldering. • Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron: Less than 25 W Temperature: Less than 350°C or less

Time: within 3 s (Up to one time per place)

92009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comRecommended soldering pattern

2.45 1.3 2.452.7 Unit: mm

Cleaning

When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our dipping tests (carried out under the recommended conditions) confirm that these solvents have no effect on semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account the cleaning conditions and usage conditions.

Cleaning Solvent Manufacturer ASAHI GLASS KAO

ARAKAWA CHEMICAL

ASAHI CLEAN AK-225AES

KAO CLEAN THROUGH 750H PINE ALPHA ST-100S

Precautions When Mounting

Do not apply force to plastic parts of the LED under high-temperature conditions.

The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.

When installing the PCB in a product, ensure that the device does not come into contact with other components.

This product doesn't apply mounting that solder flow. Please mount on recommended reflow solder mounting condition.

Tape Specifications

1. Product number format

The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (This method, however, does not apply to products whose electrical characteristics differ from standard Toshiba specifications.) (1) Tape Type: T20 (8-mm pitch) (2) Example

TLSM1050 (T20)

Tape type

Toshiba product No.

2. Handling precautions

Tape material protected against static electricity. However, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover.

(a) In process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize the ions. (b) For transport and temporary storage of devices, use containers(boxes, jigs, and bags) that are made of anti-static materials or of materials that dissipate electrostatic electricity.

102009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.com3. Tape dimensions

Symbol

Dimension ToleranceSymbol

Dimension

(Unit: mm) Tolerance

D 1.5 +0.1/−0 P2 2.0 ±0.05 E 1.75 ±0.1 W 12.0 ±0.2 P0 4.0 ±0.1 P 8.0 ±0.1 t 0.4 ±0.05 A0 5.5 ±0.1 F 5.5 ±0.05 B0 5.5 ±0.1 D1 1.6 ±0.1 K0 4.4 ±0.1

P0 D P2EFWtK0B0

POLARITY

P A0 D1112009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.com4. Reel dimensions

Unit: mm

13 ± 0.3 15.4 ± 1.0 180 +0 −4 φ44 2 ± 0.5

5. Leader and trailer section of tape

40mm or more 40mm or more Leading part 190 mm (min) φ13φ60122009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.com6. Packing form

(1) Packing quantity

Reel 400 pcs Carton 2,000 pcs

(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.

7. Label format

(1) Example: TLSM1050 (T20)

P/N: TOSHIBA

TYPE ADDC

TLSM1050

(T20) Q’TY

400 pcs

Lot Number Key code for TSB 32C 400

(RANK SYMBOL)

Use under 5-30degC/70%RH within 168h

SEALED [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y380xxxxxxxxxxxxxxxxxx* ASSEMBLED IN *****

（２）Label location

• Reel Tape reel direction• Carton

Label position Label position •

The aluminum package in which the reel is supplied also has a copy of the label attached to the center of one side.

*The Lot Number includes the following information. April 27, 2009” Example: 270 9 D 3 G → “Packaged

a b c d e a: Domestic ID b: c: d: e:

Last digit of the year (CE): “0” (Y2000), “1” (Y2001), “2” (Y2002) to “9” (Y2009)

Repeated for each decade

Month: “A” (Jan), “B” (Feb), “C” (Mar) to “L” (Dec) Decade of the month: “1” (First), “2” (Middle), “3” (Last)

Day in d above: “A” (1st), “B” (2nd), “C” (3rd) to “J” (9th), “K” (10th)

“L” denotes the 31st of the month

“I” is not used to denote a day in this date system

132009-07-09

TL(RM,RMM,SM,OM,YM)1050(T20) www.smdled.comRESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this

document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

142009-07-09