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Method of fabricating organic devices by stamping

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专利名称:Method of fabricating organic devices by

stamping

发明人:Kim, Changsoon,Forrest, Stephen R.申请号:EP100153.3申请日:20031202公开号:EP230B1公开日:20180124

摘要:The invention relates to a method of fabricating an organic device, comprising:depositing a first organic layer onto a patterned, soft elastomeric stamp; and

transferring the first organic layer from the patterned, soft elastomeric stamp onto asubstrate.

申请人:UNIV PRINCETON

地址:US

国籍:US

代理机构:Maiwald Patentanwalts GmbH

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