Sputter cathode and method for the manufacture of

专利名称：Sputter cathode and method for the

manufacture of this cathode

发明人：Vanderstraeten, Johan申请号：EP93110273.5申请日：19930628公开号：EP0586809A1公开日：19940316

专利附图：

摘要：This invention is relating to a sputter cathode (1) with a layer of material that isapplied to a substrate by sputtering, wherein this layer (3) contains low electricalconductivity particles (3a) of which a certain quantity are at least coated by a film (3b) of

electrically conductive material, or which form an aggregate with a conductive material,so as to give this layer (3) sufficient electrical conductivity to be able to be applied to thesubstrate by means of sputtering.

申请人：\"EMIEL VANDERSTRAETEN\" Société de personnes à responsabilité limitée

地址：Oude Brusselseweg 76 B-9219 Gent Gentbrugge BE

国籍：BE

代理机构：Callewaert, Jean

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