Method of producing an optical or electronic modul

专利名称：Method of producing an optical or

electronic module provided with a plasticcasing

发明人：HURT, HANS,WITTL, JOSEF,WEBERPALS,

FRANK,SCHUNK, NIKOLAUS,AUBURGER,ALBERT,PAULUS, STEFAN

申请号：EP04090301.5申请日：20040728公开号：EP1622204A1公开日：20060201

专利附图：

摘要：A component(1) is encapsulated in a plastic material(40) which forms a

housing(4). The position of the component is recorded before or after encapsulation bydirect measurement. The component is then aligned relative to a tool(30), the alignmentbeing dependent on the recorded position of the component. An area of the plastic isthen removed by the tool between the outside of the housing and an active area(11) ofthe component so that the latter area is exposed to the environment. Direct

measurement of the component position can be made by an image recognition systembefore or after encapsulation, in the later case the plastic being transparent. Directmeasurement of component position after encapsulation can also be achieved with non-transparent plastic using ultrasonic or X-ray equipment(20). Electrical connections(5) tothe component are made before encapsulation, the connections being in a housing arearemote from that which is subsequently removed. Electrical connections are made bybonded wires. The component may be mounted on a support before encapsulation. Atypical support comprises a lead frame(3) with flat supporting area(32) and severalcontact areas(31) at the frame edge. Removal of plastic can be effected with a millingtool or a laser beam. Encapsulation involves either casting or pressing of one or moreplastics around the component. The housing opening created by removal of plastic hasan axis of symmetry coincident with the component axis.

申请人：AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.

地址：Wernerwerkdamm 16 13629 Berlin DE

国籍：DE

代理机构：Müller, Wolfram Hubertus

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